INNOViON Corporation, the leading global provider of foundry ion implantation services for the micro-electronics industry, has expanded its high energy capabilities.
“Due to the significant increase in demand for high energy capacity to support the growth in the compound semiconductor market – most notably the VCSEL sector – we have added significant capacity” said INNOViON’s CEO, Tim Townley. “The release of our newest high energy implanter completes an expansion phase to ensure capacity, capability and fast turn times for our compound semiconductor customers and we’re going to keep investing” added Townley.
INNOViON’s high energy expansion broadens the range of elements that can be implanted to support conventional processes for compound semiconductor and silicon technologies at energies into the MeV range. Processes such as 800keV helium, MeV arsenic or 550keV proton implants are now readily available on wafer sizes up to 150mm. Using a wide variety of substrate diameters, INNOViON can support the coming generations of compound devices for IoT, sensing, photonics and advanced communications technologies.
“We are excited about the explosive growth that we are seeing in global demand for compound semiconductors. With our capacity additions, technology leadership and supporting infrastructure, we continue to capture significant customer interest and long term contracts while expanding our leadership position in ion implant outsourcing worldwide” according to Townley.
INNOViON Corporation is the world leader in foundry ion implant support and service for the microelectronic industry. We empower customers with our unique technical solutions and cost effective alternatives. Our flexible business model and installed base of 25 implanters delivers for over 200 customers annually, including aggressive growth in the area of compound semiconductors.