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INNOViON maintains a large complement of high and medium current implanters and
multiple MeV and low-energy capable tools for handling 2-inch to 200mm substrates,
including state-of-the-art Axcelis GSD and Varian E500 tool sets. All implant processing
is performed within Class 10 or better micro environments at the tools
(Class 1 equivalent for specific tool sets). Wafer diameters from 150-200mm can be
accommodated in either standard shipping cassettes or SMIF pods.
200mm Diameter
- Axcelis GSD/200E, GSD/200EE, GSD/HE
- Varian VIISion
- Varian E1000
- Varian E500
- Varian E220
≤ 150mm Diameter
- Axcelis GSD/HE
- Axcelis GSD/200E
- Varian VIISion
- Varian E1000
- Varian E220
- Custom NV based HE
- Eaton NV10-180
- Eaton NV10-160
- Eaton NV10-80
- Eaton 6200A
- Eaton 6200AV
Specialty Diameters
- 2”, 3” and smaller diameter substrate processing available
- Capabilities to handle fractional and unique substrate materials
Key Features and Capabilities
- Energy range from 500 eV to 3.0 MeV
- Choice of full-ring clamp, 2-point clamp, clampless disks or single wafer processing
- Tilt angle from 0° to 60°
- Implant rotation capability
- Chained Implants
- Heated Implants
- High energy capabilities for all diameters
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Varian EHP500
Axcelis GSD 200
Preventive Maintenance
Dessicator Storage of Implanter Wheels
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